Launching the CIRC-UITS Video Series: Meet Our Partners
We’re excited to launch our CIRCUITS video series, a journey through the partners powering the CIRC-UITS European project!
We’re excited to launch our CIRCUITS video series, a journey through the partners powering the CIRC-UITS European project!

How can digital solutions make electronics and automotive products last longer, be easier to repair, and reduce our dependence on scarce raw materials?

Within the European project CIRCUITS, MARAS plays a key role in assessing and optimising product circularity.

By providing next-generation materials and deep expertise in electronic materials, MacDermid Alpha Electronic Solutions supports the redesign and reengineering of products and components, enabling a significant reduction in carbon footprint.

Within CIRCUITS, our partner CRF plays a pivotal role by conducting advanced material characterization for our pilotprojects.

Our partner OFFIS – Institute for Information Technology teamed up with Bosch in the European CIRCUITS project to make ECU repair smarter and greener. Using high-resolution imaging and AIanalysis 🤖,

From 📅 June 16th to 19th, our partner University of Applied Sciences and Arts of Southern Switzerland (SUPSI) represented the CIRCUITS project at the international ICE Conference 2025, hosted by

We are pleased to invite you to the event “Driving Circularity in Electronics and Automotive”, hosted by MADE – Competence Center Industry 4.0 on Wednesday, June 11th, 2025 at 10:30 AM. Organized

📅 April 28–30, 2025 📍 O2 universum, Prague, Czech Republic 🔗 www.mlprague.com We’re pleased to announce that our valued partner University of Applied Sciences and Arts of Southern Switzerland (SUPSI) will

The Southwest Hungarian Engineering Cluster – managed by our project partner, PBKIK – recently held its 98th Benchmarking Club Meeting at the ZIEHL-ABEGG Ltd. site. During the factory tour, participants

LOPEC (Large-area, Organic & Printed Electronics Convention) is the world’s leading exhibition and conference for flexible, organic and printed electronics. Thiy year it’s taking place from February 25-27 in Munich,

CEN and CENELEC is organizing a workshop in connection to a CWA that establishes a common view on how a Digital Product Passport (DPP) for Printed Circuit Boards (PCB) should